Motherboard 2nd Gen Intel® Xeon® Scalable Processors Supported

Chassis New Generation X11 Motherboards Supported

Server Superior Performance, Efficiency and Time-to Market for Rapid Adoption

Blade Resource-Saving Architecture with High Performance, Density and Efficiency

AMD Solution Broadest Portfolio Optimized for New AMD Series

Embedded Optimized for a wide varity of applications and environments

Accessory High Quality, High Performance, and Easy-to-Use Accessories

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Key Features

  1. Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s CPU1: Skylake-F CPU supported
  2. Intel® C622
  3. Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
  4. 4 PCI-E 3.0 x16
    • 2 PCI-E 3.0 x8
    • M.2 Interface: PCI-E 3.0 x4
    • M.2 Form Factor: 2260, 2280, 22110
    • 2 PCI-E 3.0 NVMExpress x4 Internal Port(s)
  5. 1 VGA port
  6. Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  7. Dual LAN with 10GBase-T with Intel® X722 + x557
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